Key factors
symAEHR
exchUS
MCap332.05M
Beta2.012
PE Ratio16.21
EPS0.71
Div date0000-00-00
Yesterday
symAEHR
exchUS
close10.82
50 Day MA15.52
200 Day MA31.04
52 Week High54.1
52 Week Low10.53
Target Price 12.0
Market Cap Mln332.05
Share statistics
Shares Outstanding28.84M
Shares Float27.27M
Percent Institutions73.57
PercentInsiders5.863
SharesShort5919.79K
Short Ratio5.42
Shares Short Prior Month5964.11K
Short Percent21.62
Revenue TTM 81.53M
Revenue Per Share TTM 2.866
Quarterly Revenue Growth YOY 44.69
Gross Profit TTM 23.66M
EBITDA19.52M
Diluted Eps TTM0.71
Quarterly Earnings Growth YOY53.79
earning
Operating Margin TTM 0.255
PEGRatio 5.92
Trailing PE 16.21
EPS Estimate Current Quarter 0.19
EPS Estimate Current Year 0.47
EPS Estimate Next Year 0.55
Earnings Share 0.71
Dividend
Dividend Date0000-00-00
Last Split Date 0000-00-00
business
Enterprise Value Ebitda 14.76
Enterprise Value Revenue3.531
Book Value /share 3.023
Price Book MRQ 3.843
Price Sales TTM 4.072
ProfitMargin 0.257
ReturnOnAssetsTTM 0.140
ReturnOnEquityTTM0.292
Gic GroupSemiconductors & Semiconductor Equipment
Gic IndustrySemiconductors & Semiconductor Equipment
Gic Sector Information Technology
Gic Sub Industry Semiconductor Materials & Equipment
IndustrySemiconductor Equipment & Materials
SectorTechnology
ISIN US00760J1088
CIK 1040470
Code AEHR
CUSIP 00760J108
Employer Id Number 94-2424084
CountryISO US
Currency CodeUSD
Currency Name US Dollar
Exchange NASDAQ
Currency Symbol $
Type Common Stock
UpdatedAt 2024-04-05
Home Category Domestic
Fiscal Year End May
Full Time Employees104.0
IPODate 1997-08-14
International Domestic Domestic
MostRecent Quarter2023-11-30
Contact
NameAehr Test Systems
Address400 Kato Terrace, Fremont, CA, United States, 94539
Country NameUSA
Phone510 623 9400
Web URLhttps://www.aehr.com
Logo URL/img/logos/US/AEHR.png
Aehr Test Systems provides test solutions for testing, burning-in, and semiconductor devices in wafer level, singulated die, and package part form, and installed systems worldwide. Its product portfolio includes FOX-XP and FOX-NP systems that are full wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize range of devices, including silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The company also offers FOX-CP system, a low-cost single-wafer compact test solution for logic, memory, and photonic devices; FOX WaferPak Contactor, a full wafer contactor capable of testing wafers up to 300mm that enables integrated circuit manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. In addition, it provides FOX DiePak Carrier, a reusable temporary package that enables IC manufacturers to perform final test and burn-in of bare die and modules; and FOX DiePak Loader. The company was incorporated in 1977 and is headquartered in Fremont, California.